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| GP2L09/GP2L24/GP2L26 GP2L09/GP2L24 GP2L26 s Features 1. Compact and thin GP2L09: Compact DIP, long lead type GP2L24: Compact DIP type GP2L26: Flat lead type 2. Optimum detection distance: 0.6 to 0.8mm 3. High sensitivity ( IC: MIN. 0.5mA at I F = 4mA ) 4. Visible light cut-off type Subminiature, High Sensitivity Photointerrupter s Applications 1. Cassette tape recorders, VCRs 2. Floppy disk drives 3. Various microcomputerized control equipment s Outline Dimensions ( 0.4 ) Detector center ( 0.2 ) Emitter center ( 0.2 ) Emitter center ( 0.4 ) Detector center GP2L09 GP2L24 ( Unit : mm ) 4 3 C0.7 1 1.75 2 Tolerance: 0.15mm ( ): Reference dimensions The dimensions indicated by g refer to those measured from the lead base. g 4.0 0.2 3.0 + 0.2 - 0.1 4 3 C0.7 1 1.75 2 Tolerance : 0.15mm ( ) : Reference dimensions The dimensions indicated by g refer to those measured from the lead base. g 4.0 0.2 + 3.0 - 0.2 0.1 12.5 1.0 1.7 0.15 4.0 + 0.2 - 0.1 4.0 + 0.2 - 0.1 0.75 1.7 4 - (0.6) 4 - 0.5 + 0.2 - 0.1 0.8 4 - 0.2+ 0.3 -0 (4.0) : 0 to 20 4 - 0.4 + 0.2 - 0.1 4 - 0.15 + 0.2 - 0.1 (4.0) 15 : 0 to 20 15 GP2L26 ( 0.2 ) Emitter center ( 0.4 ) Detector center Internal connection diagram (Common to 3 models ) 4 3 1.75 4 3 C0.7 1 2 20 4.0 + 0.2 - 0.1 + 0.2 0.1 Tolerance : 0.15mm ( ): Reference dimensions 0.15 - 3.0 - + 0.2 0.1 1 2 1 2 3 4 Anode Emitter Collector Cathode 0.75 1.7 0.4 + 0.2 - 0.1 13.0 1.0 " In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device." 30 3.5 - 1.0 0 + GP2L09/GP2L24/GP2L26 s Absolute Maximum Ratings Parameter Forward current Reverse voltage Power dissipation Collector-emitter voltage Emitter-collector voltage Collector current Collector power dissipation Total power dissipation Operating temperature Storage temperature 1 Soldering temperature Symbol IF VR P VCEO VECO IC PC Ptot T opr T stg T sol Rating 50 6 75 35 6 50 75 100 - 25 to + 85 - 40 to + 100 260 ( Ta = 25C ) Unit mA V mW V V mA mW mW C C C Input Output 1 Within 5 seconds ( Soldering areas for each model are shown below. ) GP2L09, GP2L24 Soldering area The hatched area more than 1mm2 away from the lower edge of package as shown in the drawing below. GP2L26 Soldering area The hatched area more than 2.0mm away from the both edge of package as shown in the drawing below. 2 GP2L09: 4mm 1mm2 2.0mm 2.0mm s Electro-optical Characteristics Input Output Transfercharacteristics Parameter Forward voltage Reverse current Collector dark current 3 Collector current Response time 4 ( Ta = 25C ) Symbol IF IR ICEO IC tr tf I LEAK Conditions IF = 20mA VR = 6V VCE = 10V, I F = 0 VCE = 2V, I F = 4mA VCE = 2V, I C = 10mA RL = 100 , d = 1mm IF = 4mA, VCE = 5V MIN. 0.5 TYP. MAX. 1.2 1.4 10 1x 10 - 6 3.0 15.0 80 400 70 400 5.0 Unit V A A mA s s A Rise time Fall time Leak current 3 The condition and arrangement of the reflective object are shown in the right drawing. 4 Without reflective object The ranking of collector current shall be classified into the following 6 ranks. (GP2L09, GP2L24, GP2L26) Rank A B C A or B B or C A, B or C 5 Collector current I C ( mA ) 0.5 to 1.9 1.45 to 5.4 4.0 to 15.0 0.5 to 5.4 1.45 to 15.0 0.5 to 15.0 Test Condition for Collector Current Al evaporation 1mm-thick glass 5 GP2L24 and GP2L26 don't have A rank. GP2L09/GP2L24/GP2L26 Fig. 1 Forward Current vs. Ambient Temperature 60 50 Forward current I F ( mA ) Power dissipation P ( mW ) Fig. 2 Power Dissipation vs. Ambient Temperature 120 P tot 100 80 75 60 P, P 40 C 30 20 10 0 - 25 40 20 0 - 25 0 25 50 Ambient temperature T a 75 85 ( C ) 100 0 25 50 75 85 Ambient temperature T a ( C ) 100 Fig. 3 Peak Forward Current vs. Duty Ratio 2000 Peak forward current I FM ( mA ) 1000 500 Pulse width <=100 s T a = 25C Fig. 4 Forward Current vs. Forward Voltage 500 200 Forward current I F ( mA ) 100 50 20 10 5 2 T a = 75C 50C 25C 0C - 25C 200 100 50 20 10 - 3 2 5 10 - 2 2 5 10 - 1 2 5 1 1 0 0.5 Duty ratio 1.0 1.5 2.0 Forward voltage V F ( V ) 2.5 3.0 Fig. 5 Collector Current vs. Forward Current 25 V CE= 2V T a = 25C Fig. 6 Collector Current vs. Collector-emitter Voltage 16 T a = 25C 14 Collector current I C ( mA ) 12 10 8 7mA 6 4 4mA 2mA 0 0 2 4 6 8 10 Collector-emitter voltage V CE ( V ) 12 Pc ( MAX. ) IF= 15mA 10mA 20 Collector current I C ( mA ) 15 10 5 2 0 0 2.5 5.0 7.5 10.0 12.5 Forward current I F ( mA ) 15.0 GP2L09/GP2L24/GP2L26 Fig. 7 Relative Collector Current vs. Ambient Temperature 150 IF= 4mA V CE= 5V Relative collector current ( % ) Collector dark current I CEO ( A ) 125 100 75 Fig. 8 Collector Dark Current vs. Ambient Temperature 10 10 10 10 10 10 10 10 -4 5 -5 V CE= 10V 5 -6 5 -7 5 -8 50 5 -9 5 - 10 25 0 - 25 5 - 11 0 25 50 75 Ambient temperature T a ( C ) 100 - 25 0 25 50 75 Ambient temperature T a ( C ) 100 Fig. 9-a Response Time vs. Load Resistance ( GP2L09) 1000 500 200 Response time ( s ) 100 50 20 10 5 2 1 10 20 50 100 Load resistance R 200 () 500 1000 ts td V CE= 2V IC= 10mA T a = 25C Fig. 9-b Response Time vs. Load Resistance (GP2L24/GP2L26) 1000 500 V CE= 2V IC= 10mA T a = 25C tr tf Response time ( s ) 200 100 50 20 10 5 2 1 0.5 0.2 0.1 1 tr tf td ts L 10 100 1000 Load resistance R L ( ) 1000 Test Circuit for Response Time Fig.10 Relative Collector Current vs. Distance between Sensor and Al Evaporation Glass 100 IF= 4mA Relative collector current ( % ) V CE= 2V T a = 25C VCC RL Output Input Output 10% td tr 90% ts tf 80 Input R D 60 40 20 3 1 2 4 5 Distance between sensor and Al evaporation glass d ( mm ) 0 0 GP2L09/GP2L24/GP2L26 Fig.11 Relative Collector Current vs. Card Moving Distance ( 1 ) 100 IF= 4mA V CE= 2V Relative collector current ( % ) Relative collector current ( % ) 80 d= 1mm T a = 25C 80 Fig.12 Relative Collector Current vs. Card Moving Distance ( 2 ) 100 IF= 4mA V CE= 2V d= 1mm T a = 25C 60 60 40 40 20 20 0 -1 1 3 5 0 2 4 Card moving distance L ( mm ) 6 7 0 -2 -1 0 1 2 3 4 Card moving distance L ( mm ) 5 6 Test Condition for Distance & Detecting Position Characteristics (EX.: GP2L24 ) Correspond to Fig.10 Al evaporation GP2L24 Correspond to Fig.11 Test condition IF = 4mA VCE = 2V d = 1mm OMS card White d Black Lmm d Fig.13 Frequency Response (GP2L09 ) V CE = 2V I C = 10mA T a = 25C Correspond to Fig.12 Voltage gain Av ( dB ) Test condition IF = 4mA VCE = 2V d = 1mm 0 -5 OMS card White d Black Lmm - 10 R L= 1k 100 10 - 15 + L= 0 + L= 0 - - 20 10 2 2 5 10 3 2 5 10 4 2 Frequency f ( Hz ) 5 10 5 2 Fig.14 Frequency Response (GP2L24 / GP2L26 ) 5 IF= 10mA V CE= 2V T a = 25C Fig.15 Spectral Sensitivity ( Detecting Side ) 100 T a = 25C 80 Relative sensitivity ( % ) 0 Voltage gain Av ( dB ) -5 R L= 1k - 10 100 60 10 40 - 15 20 - 20 102 103 104 105 Frequency f ( kHz ) 106 0 600 700 800 900 1000 Wavelength ( nm ) 1100 1200 GP2L09/GP2L24/GP2L26 s Precautions for Use ( 1 ) In order to stabilize power supply line, connect a by-pass capacitor of more than 0.01 F between Vcc and GND near the device. ( 2 ) In this product, the PWB is fixed with a resin cover, and cleaning solvent may remain inside the case; therefore, dip cleaning or ultrasonic cleaning are prohibited. ( 3 ) Remove dust or stains, using an air blower or a soft cloth moistened in cleaning solvent. However, do not perform the above cleaning using a soft cloth with cleaning solvent in the marking portion. In this case, use only the following type of cleaning solvent used for wiping off: Ethyl alcohol, Methyl alcohol, Isopropyl alcohol, Freon TE, Freon TF, Diflon solvent S3-E When the cleaning solvents except for specified materials are used, please consult us. ( 4 ) As for other general cautions, refer to the chapter " Precautions for Use " . |
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